ELECTRONIC PRODUCT TEST ENGINEER

Salary not specified

MALAYSIA
COLLEGE GRADUATE
Permanent

Job Description

 To oversee the smooth running of the assigned engineering team’s support in handling daily wire bond related issues and resolving them in a timely manner with minimum supervision.

To ensure all works on continuous improvement projects to improve yield, increase machine productivity, reduce manufacturing costs and enhance process capability meet departmental KPI.

 To develop the skill sets of existing & new team members to carry out their job responsibilities well.

To lead and actively participate in regular engineering, NPI, operation and quality meeting.

Able to lead, organize and coordinate multiple projects in a timely manner.

To work closely with cross functional departments to deliver the solutions to meet customers and company expectations.

 Ensure proper documentation such as Standard Operating Procedures, FMEA, Control Plan, Work Instruction, etc are done and supported.

 Support customer audit / visit.

 Leadership & management skills

Any other duties assigned from time to time.

Qualifications/Requirements

Experience in Semiconductor industry is an advantage.

ASE Malaysia Products: Lead Frame Packaging, Wire Bond BGA, Flip Chip Packaging, Power DFN/QFN with Cu Clip, Memory Packaging & WLCSP (backend)

Work location

MALAYSIA

Remarks

No additional remarks

About the company

Our company details JobsConnect Manpower Agency, Inc. is duly registered and existing with...

Industry

OTHER COMMUNITY, SOCIAL AND PERSONAL SERVICE ACTIVITIES

Employment size

10 - 99 (Small)

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