ELECTRONICS AND COMMUNICATIONS ENGINEER

The role of the Package Intrinsic Reliability Engineer is to plan and execute stress test plans to de-risk or validate new technology platforms. Working in a team environment, testing plans may include intrinsic reliability characterizations, new package robustness evaluations, or advanced look ahead studies to draw out new mechanisms. Qualification plans for new or re-designed products, processes and packages are also developed. The Intrinsic Reliability Engineer also assists in the root cause analysis of qualification failures and drives appropriate corrective and preventive actions using structured problem-solving methods. Sustaining support for current products would include risk assessments of any field events.

• Key duties of the Reliability Engineer:
  • Developing qualification plans, reliability evaluations, and risk assessments in a timely manner.
  • Application of physics of failure models with regards to intrinsic package level reliability e.g. solder joint reliability, and interconnect electromigration
  • Developing test vehicles and novel test set-ups for failure mechanism characterization
  • Performing reliability statistical calculations, such as MTTF, MTBF, FIT, and failure rate modeling
  • Documenting best practices
  • Progressing a product/technology through the product development cycle.
  • Assisting in or developing Failure Modes and Effects Analysis (FMEA) or other assessments based upon a structured risk evaluation methodology
  • Leading structured problem-solving teams using six sigma methodologies, such as 8D
  • Communicating and interpreting qualification requirements within a cross-functional environment.
  • Identifying and planning for application specific mission profiles
  • Supporting internal/external customers with general reliability related inquiries.