Team Pacific Corporation is a leading service provider for Semiconductor Assembly and Test, differentiated by its capabilities in complex high power and high reliability semiconductor assembly in both standard and custom build outline packages for specific solutions.
Equipped with more than 30 years of industry experience in both technical and service excellence, Team Pacific Corporation prides itself to be a leader in complex semiconductor assembly such as high power discrete devices in SOT227 and eXp TO247 (patented); various isolated transistor outlines and custom build power modules (VPMPs); highly reliable hermetic packages; and medical die inspection and die sales. Our current customers use these products on a broad range of applications such as optoelectronic sensors, audio, military, medical, transportation, industrial, and renewable energy, including some devices used in the International Space Station (ISS). This proves our deep commitment to quality as we continue to remain as a strategic partner for our customers.
In line with the ever changing requirements of the industry and of our customers, Team Pacific Corporation also provides customized services aside from the usual subcontracting arrangement. The company is able to help customers in product development, especially if a custom package outline is required. We are also capable of setting-up captive assembly lines that can be co-managed with the customers, as well as full assembly line transfers from customers who want to re-focus their organization on product development.