ON Semiconductor SSMP Phils. Corp.

Job Vacancy: Package Development Staff Engineer

To apply, kindly login with your account.

Login as a Jobseeker

? ?Develops new packaging to meet established requirements and maintains oversight and quality of existing packages for all product groups

? ?Defines package requirements for product groups and customer requirements

? ?Develops recommendations according to the nature of the product, cost limitations, taking into consideration the need for resistance to external variables

? ?Coordinates activities and logistics

? ?Uses appropriate tools and performs integrity analysis of packaging

? ?Defines controls and do DOE’s for process assigned

? ?Set-ups machine and run characterization on packages/devices as assigned.

? ?Laisses with New Product Introduction Operations and other support groups

? ?Develops evaluates, revises and applies technical protocols/methods related to the project.

? ?Performs analysis and trends for in-process materials and bulk raw materials and recommends corrective action if necessary

? ?Assures compliance with in-house and/or external specifications and standards
  • Initiates the qualification/productization of new devices related to Dicing, DB, Clip Bond, and wirebond for FOL and any processes at EOL

  • Work Experience: 5 year/s and 8 month/s
  • Salary: ₱50,000 - ₱50,000
  • Women
  • Balikbayans/OFW Returnees

? ?Knowledgeable in clip bonding.

? ?Can generate Gantt Charts/ Timeline using MS project

? ?Can operate equipment related to Dicing, Clip/Frame bonding, Die bonding, and saw machines.

? ?Can conduct design of experiments on new packages and performs analysis and trends for in-process materials.


with high level of independency