ON Semiconductor SSMP Phils. Corp.

Job Vacancy: Package Development Staff Engineers

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? ?Develops new packaging to meet established requirements and maintains oversight and quality of existing packages for all product groups.

? ?Defines package requirements for product groups and customer requirements.

? ?Develops recommendations according to the nature of the product, cost limitations, taking into consideration the need for resistance to external variables.

? ?Coordinates activities and logistics.

? ?Uses appropriate tools and performs integrity analysis of packaging.

? ?Defines controls and do DOE’s for process assigned.

? ?Set-ups machine and run characterization on packages/devices as assigned.

? ?Laisses with New Product Introduction Operations and other support groups.

? ?Develops, evaluates, revises and applies technical protocols/methods related to the project.

? ?Performs analysis and trends for in-process materials and bulk raw materials and recommends corrective action if necessary.

? ?Assures compliance with in-house and/or external specifications and standards.

? ?Initiates the qualification/productization of new devices related to Dicing, DB, Clip Bond, and wirebond for FOL and any processes at EOL.

  • Work Experience: 5 year/s
  • Salary: ₱50,000 - ₱50,000
  • Women
  • Balikbayans/OFW Returnees

? ?Knowledgeable in clip bonding.

? ?Can generate Gantt Charts/ Timeline using MS project

? ?Can operate equipment related to Dicing, Clip/Frame bonding, Die bonding, and saw machines.

? ?Can conduct design of experiments on new packages and performs analysis and trends for in-process materials.

not applicable

Can work independently