Packaging Engineer (Die Attach expert)
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
As a member of our packaging team, you’ll have the chance to interact with many product groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
About the job:
As a member of our packaging team, you’ll have the chance to interact with many product and business groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the Semiconductor Packaging (SCP) organization.
This position shall assume responsibility for the development of new devices, packages, technologies being developed in SCP. You will be responsible for defining, developing, qualifying, and ramping new devices, packages, and technologies to production. You are expected to initiate, lead, and manage face to face meetings and teleconferences with key players and stakeholders across all organizations that are key in ensuring the success of the project.
As a Packaging Engineer at Die-attach, you should be able to develop new package requirements and maintaining its quality for all product groups. Be able to define package requirements for product groups and customer requirements. Develop new package and package qualification programs. Perform integrity analysis of packages utilizing appropriate tools. Perform package characterizations including cost effectiveness studies. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Prepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies. Follow standard practices and procedure in analyzing situations or data from which answers can be readily obtained.